Wuxi-based Autolink Intelligence Tech updated its prospectus on May 29, as it continues to pursue a main board listing on the Hong Kong Stock Exchange. CICC and Guotai Haitong Securities are serving as joint sponsors.
Founded in 2014, Autolink’s portfolio now spans in-vehicle computing solutions and zonal controller solutions. The company has established partnerships with China’s five largest domestic-brand automakers, according to its prospectus. As of May 22, its products covered 45 brands under those automakers. By the same date, its cumulative number of vehicle model design wins, an industry term for being selected to supply technology for specific models, had increased to 164.
At the product level, Autolink said it became the first company in the world in 2021 to launch and mass produce an intelligent cockpit domain controller based on Qualcomm’s Snapdragon SA8155P platform. According to Frost & Sullivan data cited in the prospectus, cumulative shipments of cockpit domain controllers based on Qualcomm’s SA8155P platform had exceeded 2.3 million units as of May 22, ranking first globally.
In cockpit-driving integration, Frost & Sullivan data shows that Autolink’s AL-A1 series, built on Qualcomm’s SA8775P platform, was the world’s first single-chip cockpit-driving integrated product to debut and enter mass production. The product was installed in both the battery-powered and range-extended versions of BAIC’s Arcfox Alpha T5, which entered mass production in the third quarter of 2025. As of December 31, 2025, products based on the SA8775P platform had secured design wins for ten vehicle models. As these projects move from design wins to mass production, cockpit-driving integration could become an important source of revenue growth for Autolink.
For next-generation central computing products, Autolink released its Deep Fusion electronic and electrical architecture (EEA) in January. The architecture integrates a central computing platform, zonal controllers, and high-speed optical communication. It is designed to support advanced driving assistance, on-device large models, in-vehicle artificial intelligence agents, ultra-high-definition video perception, and full-scenario intelligent interactions.
As large model capabilities move from the cloud into vehicles, intelligent cockpits are evolving from collections of functions into in-vehicle AI interaction gateways. Autolink has positioned itself around this trend through two product paths, AI box and AI cockpit:
- Its AI box connects independently with a vehicle’s existing cockpit and driving systems, adding on-device AI capabilities to current vehicle models. It is designed to help automakers meet demand for AI upgrades from existing users more quickly and with lower modification costs.
- AI cockpit, by contrast, is aimed at mid- to high-end and premium models. It emphasizes the ability to run on-device large models and deliver low-latency responses for products built on newly developed vehicle architectures.
In in-vehicle optical communication, Autolink has begun joint R&D and validation of in-vehicle optical communication modules with a leading domestic optical communication company. The work focuses on applying PCIe 4.0 optical communication technology to vehicle products. Although the initiative remains in an early incubation stage, it could give Autolink a differentiated position as automakers move toward the next generation of vehicle EEA.
Autolink’s early position in cockpit domain controllers and cockpit-driving products, along with its record of scaled mass production, suggests it has built platform-level capabilities. Its early work in AI products and optical communication also gives it a longer-term reserve for intelligent in-vehicle experiences and the communication systems that support them. The company is seeking to move deeper into higher-value vehicle architecture layers and become a long-term technology partner for automakers as they develop more intelligent vehicles.
A key reason Autolink has been able to expand its product portfolio is its in-house R&D and platform-based architecture. As of December 31, 2025, the company had more than 500 R&D employees, with experience across system architecture, middleware, functional algorithms, testing and validation models, and other areas of the automotive electronics value chain. This has given it full-stack in-house software and hardware capabilities:
- On the software side, Autolink has development capabilities covering base software platforms, middleware, and upper-layer applications.
- On the hardware side, it independently designs, integrates, and debugs domain controller hardware platforms, supporting faster adaptation for different customers’ projects.
Autolink said in its prospectus that it plans to use the net proceeds from its IPO mainly for R&D of connected vehicle solutions, strengthening its international capabilities, expanding production capacity, working capital, and other general corporate purposes.
This article was adapted based on a feature originally written by Stone Jin and published on IPO Zaozhidao. KrASIA is authorized to translate, adapt, and publish its contents.